Subject
Computer Science
Topic
Computer Hardware
Which thermal interface material fills microscopic gaps between CPU and heatsink?
Which thermal interface material fills microscopic gaps between CPU and heatsink?
ক)
Thermal paste (TIM)খ)
Superglueগ)
Electrical tapeঘ)
Kapton for insulationExplanation
TIM replaces air pockets with a thermally conductive medium, lowering junction-to-sink resistance. Apply a thin, even layer and ensure even mounting pressure. Too much paste can insulate and make a mess. Pads are convenient but usually less conductive.Related questions
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